Display device, apparatus for manufacturing display device and method for manufacturing display device

ABSTRACT

A display device includes a display panel including display pads, display connection pads disposed on a side surface of the display panel and connected to the display pads, a touch member including touch pads disposed on a display surface perpendicular to the side surface of the display panel, and touch connection pads overlapping a top surface of the touch member and the side surface of the display panel and connected to the touch pads. The side surface of the display panel includes a first area overlapping the display connection pads, a second area overlapping the touch connection pads, and a third area which does not overlap the display connection pads and does not overlap the touch connection pads. The first area, the second area, and the third area are located on a same plane.

CROSS-REFERENCE TO RELATED APPLICATION

This application claims priority to and benefits of Korean PatentApplication No. 10-2020-0128821 under 35 U.S.C. § 119, filed on Oct. 6,2020 in the Korean Intellectual Property Office, the entire contents ofwhich are incorporated herein by reference.

BACKGROUND 1. Technical Field

The disclosure relates to a display device, an apparatus formanufacturing the display device and a method for manufacturing thedisplay device.

2. Description of the Related Art

The importance of display devices has steadily increased with thedevelopment of multimedia technology. Various types of display devicessuch as organic light emitting displays (OLEDs), liquid crystal displays(LCDs) and the like have been developed. Such display devices have beenapplied to various mobile electronic devices, for example, portableelectronic devices such as smart phones, smart watches, and tablet PCs.

The display device includes a substrate partitioned into a display areaand a non-display area. Pixels are disposed on the substrate in thedisplay area, and pads and the like are disposed on the substrate in thenon-display area. A flexible film, such as chip on film (COF), having adriving circuit and the like is coupled to the pads to transmit drivingsignals to the pixels. To reduce the non-display area of the displaydevice, the flexible film may be attached to the side surface of thesubstrate.

The flexible film may include leads coupled to the pads, and the leadsmay be bonded to the pads separated from each other. The bonding may beperformed using an anisotropic conductive film, or may be performed byan ultrasonic bonding process in which the pads and the leads are indirect surface contact with each other.

It is to be understood that this background of the technology sectionis, in part, intended to provide useful background for understanding thetechnology. However, this background of the technology section may alsoinclude ideas, concepts, or recognitions that were not part of what wasknown or appreciated by those skilled in the pertinent art prior to acorresponding effective filing date of the subject matter disclosedherein.

SUMMARY

Aspects of the disclosure provide a display device having a side surfaceto which a circuit board is attached and capable of minimizingoccurrence of a short circuit between electrode pads.

Aspects of the disclosure also provide a display device manufacturingmethod capable of manufacturing the display device by a simple process.

Aspects of the disclosure also provide a display device manufacturingapparatus for implementing the display device manufacturing method.

However, aspects of the disclosure are not restricted to those set forthherein. The above and other aspects of the disclosure will become moreapparent to one of ordinary skill in the art to which the disclosurepertains by referencing the detailed description of the disclosure givenbelow.

An embodiment of a display device may include a display panel includingdisplay pads, display connection pads disposed on a side surface of thedisplay panel and connected to the display pads, a touch memberincluding touch pads disposed on a display surface perpendicular to theside surface of the display panel, and touch connection pads overlappinga top surface of the touch member and the side surface of the displaypanel and connected to the touch pads. The side surface of the displaypanel may include a first area overlapping the display connection pads,a second area overlapping the touch connection pads, and a third areawhich does not overlap the display connection pads and does not overlapthe touch connection pads. The first area, the second area, and thethird area may be located on the same plane.

In an embodiment, the side surface of the display panel may have auniform roughness in the first area, the second area, and the thirdarea.

In an embodiment, the side surface may include a display pad area wherethe display pads and the display connection pads may be arranged, atouch pad area where the touch pads and touch connection pads may bearranged. The touch pad area and the display pad area may be disposed ina first direction.

In an embodiment, the display pads and the touch pads may be arranged inthe first direction.

In an embodiment, the display device may further include a first circuitboard disposed on the display connection pads, and a second circuitboard disposed on the touch connection pads. A display driving circuitmay be disposed on the first circuit board. A touch driving circuit maybe disposed on the second circuit board.

The second circuit board may partially overlap the top surface of thetouch member.

In an embodiment, the display panel may include a first substrate, asecond substrate disposed on the first substrate, and a sealant disposedbetween the first substrate and the second substrate.

In an embodiment, each of the display connection pads, and the touchconnection pads may have a shape protruding toward the sealant.

In an embodiment, the second substrate may include a chamfer portionthat may be disposed at an end overlapping the display pad.

An embodiment of an apparatus for manufacturing a display device mayinclude a first stage; a first laser module that emits a first laserbeam toward the first stage; a second stage disposed on a side of thefirst stage; a pressing tool disposed above the second stage; and asecond laser module that emits a second laser beam toward the secondstage. The pressing tool may be disposed between the second laser moduleand the second stage. The first laser beam may be a short pulse laserbeam. The second laser beam may be a continuous wave (CW) laser beam.

In an embodiment, the pressing tool may include a silicon memberdisposed at a lower portion of the pressing tool.

In an embodiment, the pressing tool may include a transparent material.

In an embodiment, the bottom surface of pressing tool may include achamfer portion.

In an embodiment, each of the first stage and the second stage may havean adjustable inclination angle.

In an embodiment, the apparatus may further include a conductive filmincluding a conductive material that is patterned on the first stage andtransferred onto the side surface of the display device on the secondstage.

An embodiment of a method for manufacturing a display device may includepatterning a conductive material on a conductive film to form firstpatterns and second patterns that are larger than the first patterns,transferring the first patterns onto a side surface of the displaydevice to form a first pad, transferring the second patterns onto theside surface of the display device to form a second pad, attaching afirst circuit board on the first pad, and attaching a second circuitboard on the second pad.

In an embodiment, the patterning of the conductive material may includeapplying a short pulse laser beam.

In an embodiment, the forming of first pad and the forming of the secondpad may include applying a continuous wave laser beam.

In an embodiment, the forming of the first pad and the forming of thesecond pad may comprise disposing the conductive film including thefirst patterns and the second patterns on the side surface of thedisplay device, and disposing a pressing tool on the conductive film toirradiate the continuous wave laser beam.

In an embodiment, the attaching of the first circuit board and theattaching of the second circuit board may comprise disposing the firstcircuit board on the first pad, disposing the second circuit board onthe second pad, and disposing the pressing tool on the first circuitboard and the second circuit board to irradiate the continuous wavelaser beam.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other aspects and features of the disclosure will becomemore apparent by describing in detail embodiments thereof with referenceto the attached drawings, in which:

FIG. 1 is a schematic perspective view of a display device according toan embodiment;

FIG. 2 is a schematic plan view of a display device according to anembodiment;

FIG. 3 is a schematic side view of a display device according to anembodiment;

FIG. 4 is a schematic cross-sectional view taken along line IV-IV′ ofFIG. 2;

FIG. 5 is a schematic plan view of a display panel according to anembodiment;

FIG. 6 is a schematic partial cross-sectional view of the display panelof FIG. 5;

FIG. 7 is a schematic plan view of a touch member according to anembodiment;

FIG. 8 is a schematic cross-sectional view of a touch member accordingto an embodiment;

FIG. 9 is a schematic cross-sectional view taken along lines IXa-IXa′,IXb-IXb′, and IXc-IXc′ of FIG. 7;

FIG. 10 is a schematic diagram illustrating a side surface of a displaydevice according to an embodiment;

FIG. 11 is a schematic cross-sectional view taken along line XI-XI′ ofFIG. 10;

FIG. 12 is a schematic cross-sectional view taken along line XII-XII′ ofFIG. 10;

FIG. 13 is a schematic cross-sectional view taken along line XIII-XIII′of FIG. 10;

FIG. 14 is a schematic cross-sectional view taken along line XIV-XIV′ ofFIG. 10;

FIG. 15 is a schematic view illustrating an apparatus for manufacturinga display device according to an embodiment;

FIG. 16 is a flowchart showing a method for manufacturing a displaydevice according to an embodiment;

FIGS. 17 to 20 are schematic diagrams illustrating a method formanufacturing a display device according to an embodiment; and

FIG. 21 is a schematic cross-sectional view illustrating a displaydevice according to an embodiment.

DETAILED DESCRIPTION OF THE EMBODIMENTS

The disclosure will now be described more fully hereinafter withreference to the accompanying drawings, in which embodiments are shown.This disclosure may, however, be embodied in different forms and shouldnot be construed as limited to the embodiments set forth herein. Rather,these embodiments are provided so that this disclosure will be thoroughand complete, and will fully convey the scope of the disclosure to thoseskilled in the art.

It will also be understood that when a layer is referred to as being“on” another layer or substrate, it can be directly on the other layeror substrate, or intervening layers may also be present. In contrast,when an element is referred to as being “directly on” another element,there are no intervening elements present.

Spatially relative terms, such as “beneath,” “below,” “lower,” “above,”“upper” and the like, may be used herein for ease of description todescribe one element or feature's relationship to another element(s) orfeature(s) as illustrated in the figures. It will be understood that thespatially relative terms are intended to encompass differentorientations of the device in use or operation in addition to theorientation depicted in the figures. For example, if the device in thefigures is turned over, elements described as “below” or “beneath” otherelements or features would then be oriented “above” the other elementsor features. Thus, the term “below” can encompass both an orientation ofabove and below. The device may be otherwise oriented (rotated 90degrees or at other orientations) and the spatially relative descriptorsused herein interpreted accordingly.

The same reference numbers indicate the same components throughout thespecification.

Hereinafter, embodiments will be described in detail with reference tothe accompanying drawings.

FIG. 1 is a perspective view of a display device according to anembodiment. FIG. 2 is a plan view of a display device according to anembodiment. FIG. 3 is a side view of a display device according to anembodiment. FIG. 4 is a cross-sectional view taken along line IV-IV′ ofFIG. 2.

Referring to FIGS. 1 to 4, the display device 1 is a device fordisplaying a moving image or a still image. The display device 1 may beused as a display screen of various devices, such as a television, alaptop computer, a monitor, a billboard, and an Internet-of-Things (IOT)device, as well as portable electronic devices such as a mobile phone, asmartphone, a tablet personal computer (PC), a smart watch, a watchphone, a mobile communication terminal, an electronic notebook, anelectronic book, a portable multimedia player (PMP), a navigation deviceand an ultra-mobile PC (UMPC). The display device 1 may be an organiclight emitting display device, a liquid crystal display device, a plasmadisplay device, a field emission display device, an electrophoreticdisplay device, an electrowetting display device, a quantum dot lightemitting display device, a micro LED display device, or the like. In thefollowing, an organic light emitting display device will be described asan example of the display device 1, but the display device 1 is notlimited thereto.

The display device 1 may include a display area DA displaying an imageand a non-display area NDA disposed around the display area DA withreference to FIG. 5. The display area DA may have a rectangular shapewith right-angled or rounded corners in a plan view. The planar shape ofthe display area DA is not limited to a rectangular shape, but may havea circular shape, an elliptical shape, or various other shapes. Thenon-display area NDA may be disposed adjacent to both short sides of thedisplay area DA. Furthermore, the non-display area NDA may be disposedadjacent to both long sides as well as both short sides of the displayarea DA. The non-display area NDA may be disposed to surround all sidesof the display area DA and form edges of the display area DA.

In an embodiment, the display device 1 may be formed in a rectangularshape having short sides extending in a first direction DR1 and longsides extending in a second direction DR2 in a plan view. The cornerwhere the short side extending in the first direction DR1 and the longside extending in the second direction DR2 meet may be rounded. However,the disclosure is not limited thereto, and the corner may beright-angled. In other examples, the shape of the display device 1 in aplan view is not limited to a rectangular shape, and may have othershapes such as a polygonal shape, a circular shape, or elliptical shape.

The top surface of the display device 1 may be flat. However, thedisclosure is not limited thereto, and the top surface of the displaydevice 1 may include curved portions formed at both ends in the firstdirection DR1 or at both ends in the second direction DR2. The curvedportions may have a constant curvature or a changing curvature.Furthermore, the display device 1 may be curved, bent, folded, orrolled.

Referring to FIG. 1, The display device 1 includes a display panel 10.The display panel 10 may include a first substrate 100 and a secondsubstrate 200 disposed on the first substrate 100. A sealant SLT formedalong edges may be disposed between the first substrate 100 and thesecond substrate 200. The sealant SLT may bond the first substrate 100and the second substrate 200 to each other.

The display device 1 may further include a touch member 300. The touchmember 300 may be disposed on the display panel 10. In an embodiment,the touch member 300 may be formed on the second substrate 200. Inanother example, the touch member 300 may be provided in the form of aseparate panel and attached onto the display panel 10.

Although not shown, the display device 1 may further include apolarizing member (not shown), a cover window (not shown) disposed onthe touch member 300, and an adhesive layer (not shown) disposed betweenthe polarizing member and the cover window. The polarizing member (notshown) may block light reflected from the surface of the display device1 to improve visibility, and the cover window (not shown) may protectthe display device 1. The adhesive layer (not shown) may attach thepolarizing member (not shown) and the cover window (not shown).

Referring to FIG. 2, a first circuit board 400 and a second circuitboard 500 may be disposed on at least one side surface (the other sidesurface in the second direction DR2 in FIG. 2) of the display device 1.The first circuit board 400 may be a display driving circuit board, andthe second circuit board 500 may be a touch driving circuit board. Thefirst circuit board 400 and the second circuit board 500 may beside-bonded to at least a side surface of the display device 1.

The side surface of the display device 1 may include a display pad areaDPA where display connection pads DCP (refer to FIG. 10) are disposedand a touch pad area TPA where touch connection pads TCP (refer to FIG.10) are disposed. The display pad area DPA and the touch pad area TPAmay be disposed in parallel in a longitudinal direction (the firstdirection DR1 in the drawing) of a side surface. The first circuit board400 may be bonded to the display pad area DPA, and the second circuitboard 500 may be bonded to the touch pad area TPA.

Referring to FIG. 3, driving circuits may be disposed on the circuitboards 400 and 500. For example, a display driving circuit 410 may bemounted on the first circuit board 400, and a touch driving circuit 510may be mounted on the second circuit board 500. However, the disclosureis not limited thereto, and the display driving circuit 410 or the touchdriving circuit 510 may be omitted or may be disposed outside thecircuit boards 400 and 500.

The display driving circuit 410 may output signals and voltages fordriving the display panel 10. For example, the display driving circuit410 may supply data voltages to data lines DL (refer to FIG. 5).Furthermore, the display driving circuit 410 may supply source voltagesto a power supply line PSL (refer to FIG. 5) and scan control signals toa scan driver. The display driving circuit 410 may be formed as anintegrated circuit (IC) and mounted on the first circuit board 400.

The touch driving circuit 510 may be electrically connected to the touchelectrode of the touch member 300. The touch driving circuit 510 appliestouch driving signals to the touch electrode of the touch member 300 andmeasures the capacitance values of the touch electrode. The touchdriving signal may be a signal having driving pulses. The touch drivingcircuit 510 may determine whether a touch is inputted based on thecapacitance values, and may calculate the touch coordinates at whichtouch is inputted. The touch driving circuit 510 may be formed as anintegrated circuit (IC) and mounted on the second circuit board 500.

The circuit boards 400 and 500 may be bonded to the display device 1using an anisotropic conductive film For example, the first circuitboard 400 may be attached onto display connection pads DCP of thedisplay panel 10. Accordingly, the lead lines (not shown) of the firstcircuit board 400 may be electrically connected to the displayconnection pads DCP of the display panel 10. The second circuit board500 may be attached onto touch connection pads TCP of the touch member300. The second circuit board 500 may be disposed to cover the otherside surface of the display device 1 in the second direction DR2 and apart of one side surface of the display device 1 in a third directionDR3. The second circuit board 500 may partially overlap the top surfaceof the touch member 300 in a third direction DR3. Accordingly, the leadlines (not shown) of the second circuit board 500 may be electricallyconnected to the touch connection pads TCP of the touch member 300.

The circuit boards 400 and 500 may be a flexible printed circuit board,a printed circuit board, or a flexible film such as a chip on film

Hereinafter, the display panel 10 and the touch member 300 will bedescribed in detail with reference to FIGS. 5 to 8.

FIG. 5 is a schematic plan view of a display panel according to anembodiment. FIG. 6 is a schematic partial cross-sectional view of thedisplay panel of FIG. 5. FIG. 6 shows a part of the display area DA anda part of the display pad area DPA of the display panel 10.

Referring to FIGS. 5 and 6, the display panel 10 may include a displayarea DA in which pixels are formed to display an image, and anon-display area NDA which is a peripheral area of the display area DA.The non-display area NDA may include the display pad area DPA wheredisplay pads DP are disposed. The display pad area DPA may be disposedat the lower end (the other end in the second direction DR2 in thedrawing) of the display panel 10 in a plan view. In a plan view, thedisplay pad area DPA and the touch pad area TPA to be described latermay be disposed in parallel in the first direction DR1.

In the display pad area DPA, the display pads DP may be disposed alongthe first direction DR1. The other side surface of the display pad DP inthe second direction DR2 may electrically contact the display connectionpad DCP. The arrangement structure of the display pad DP and the displayconnection pad DCP will be described in detail later.

Scan lines SL, data lines DL, a power supply line PSL, and pixels P maybe disposed in the display area DA. The scan lines SL may be formed inparallel in the first direction DR1, and the data lines DL may be formedin parallel in a second direction DR2 which intersects the firstdirection DR1. The power supply line PSL may include at least one lineformed in parallel with the data lines DL in the second direction DR2and lines branched from the at least one line in the first directionDR1.

Each of the pixels P may be electrically connected to at least one ofthe scan lines SL, one of the data lines DL, and the power supply linePSL. Each of the pixels P may include thin film transistors including adriving transistor and at least one switching transistor, an organiclight emitting diode, and a capacitor. In case that a scan signal isapplied from the scan line SL, each of the pixels P may receive the datavoltage of the data line DL and supply a driving current to an organiclight emitting diode in response to the data voltage applied to the gateelectrode 121 to emit light.

A scan driver SD, a scan control line SCL, and data link lines DLL maybe disposed in the non-display area NDA. The data link line DLL mayelectrically connect the data line DL to the display pad DP.

The scan driver SD may be electrically connected to the display pad DPthrough at least one scan control line SCL. Therefore, the scan driverSD may receive the scan control signal. The scan driver SD generatesscan signals according to the scan control signal and supplies the scansignals to the scan lines SL.

Although FIG. 5 illustrates that the scan driver SD is formed in thenon-display area NDA located at one outer side of the display area DA,the disclosure is not limited thereto. For example, the scan driver SDmay be formed in the non-display area NDA located at both outer sides ofthe display area DA.

Referring to FIG. 6, the display panel 10 may include a base substrate101, conductive layers disposed on the base substrate 101, insulatinglayers for insulating the conductive layers, an organic light emittinglayer EL, and the like.

The base substrate 101 may be disposed over the entire display area DAand the entire non-display area NDA. The base substrate 101 may functionto support various elements disposed thereon. In an embodiment, the basesubstrate 101 may be a rigid substrate including a rigid material suchas soft glass, quartz, or the like. However, the disclosure is notlimited thereto, and the base substrate 101 may be a flexible substrateincluding a flexible material such as polyimide (PI).

The buffer layer 102 may be disposed on the base substrate 101. Thebuffer layer 102 can prevent penetration of moisture and oxygen from theoutside through the base substrate 101.

A semiconductor layer 105 may be disposed on the buffer layer 102. Thesemiconductor layer 105 may form a channel of a thin film transistor.The semiconductor layer 105 may be disposed in each pixel P in thedisplay area DA, and may also be disposed in the non-display area NDA insome cases. The semiconductor layer 105 may include a source/drainregion and an active region. The semiconductor layer 105 may includepolycrystalline silicon.

A first insulating layer 111 may be disposed on the semiconductor layer105. The first insulating layer 111 may be disposed over the entiresurface of the base substrate 101. The first insulating layer 111 may bea gate insulating layer having a gate insulating function.

A first conductive layer 120 may be disposed on the first insulatinglayer 111. In an embodiment, the first conductive layer 120 may includea gate electrode 121 and a first electrode 122 of a storage capacitor.The gate electrode 121 may be electrically connected to theabove-described scan line SL.

A second insulating layer 112 may be disposed on the first conductivelayer 120. The second insulating layer 112 may insulate the firstconductive layer 120 from a second conductive layer 130. The secondinsulating layer 112 may be selected from the above-mentioned materialsof the first insulating layer 111.

The second conductive layer 130 may be disposed on the second insulatinglayer 112. The second conductive layer 130 may include a secondelectrode 131 of the storage capacitor. The material of the secondconductive layer 130 may be selected from the above-mentioned materialsof the first conductive layer 120. The first electrode 122 of thestorage capacitor and the second electrode 131 of the storage capacitormay form a capacitor through the second insulating layer 112.

A third insulating layer 113 may be disposed on the second conductivelayer 130. The third insulating layer 113 may contain theabove-described materials of the first insulating layer 111.

A third conductive layer 140 may be disposed on the third insulatinglayer 113. The third conductive layer 140 may include a source electrode141, a drain electrode 142, a source voltage electrode 143, and displaypads DP. The source electrode 141 may be electrically connected to theabove-described data line DL.

Although not shown, the above-described second insulating layer 112 andthe third insulating layer 113 may be disposed between the display padDP and each link line. Each display pad DP and each link line may beelectrically contacted through at least one contact hole through thesecond insulating layer 112 and the third insulating layer 113. Althoughnot shown, each link line may be electrically connected to a thin filmtransistor of each pixel P in the display area DA.

The end portion of the display pad DP may be aligned with a side surfaceof the base substrate 101 and a side surface of the second substrate200. The display pad DP may not protrude from the side surface of thebase substrate 101. The side surface of the display pad DP mayelectrically contact a surface of the display connection pad DCP.

The display pad DP may be included in the third conductive layer 140.The display pad DP may be formed on the same layer as the sourceelectrode 141, the drain electrode 142, and the source voltage electrode143. However, the disclosure is not limited thereto, and the display padDP may be included in a fourth conductive layer 160 to be describedlater.

The display pad DP may contain a metal material. The display pad DP mayinclude at least one metal selected from the group consisting ofmolybdenum (Mo), aluminum (Al), platinum (Pt), palladium (Pd), silver(Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium(Ir), chromium (Cr), calcium (Ca), titanium (Ti), tantalum (Ta),tungsten (W) and copper (Cu). The display pad DP may be a single layeror a multilayer stack of the above-mentioned materials.

A first via layer 151 may be disposed in the third conductive layer 140.The other side surface of the first via layer 151 in the seconddirection DR2 may be partially covered by the display pad DP. The firstvia layer 151 may contain an organic insulating material.

A fourth conductive layer 160 may be disposed on the first via layer151. The fourth conductive layer 160 may include the power supply linePSL and a connection electrode 162. The power supply line PSL mayinclude a first power supply line 161 and a second power supply line163. The first power supply line 161 may be electrically connected tothe source electrode 141 through a contact hole penetrating the firstvia layer 151. The connection electrode 162 may be electricallyconnected to the drain electrode 142 through the contact holepenetrating the first via layer 151. The second power supply line 163may be electrically connected to the source voltage electrode 143through the contact hole penetrating the first via layer 151.

As described above, the display pad DP may be included in the fourthconductive layer 160. The display pad DP may be formed on the same layeras the first and second power supply lines 161 and 163 and theconnection electrode 162.

The second via layer 152 may be disposed on the fourth conductive layer160. The second via layer 152 may contain the same material as that ofthe first via layer 151.

An anode electrode ANO may be disposed on the second via layer 152. Theanode electrode ANO may be electrically connected to the connectingelectrode 162 through a contact hole penetrating the second via layer152.

The pixel defining layer PDL may be disposed on the anode electrode ANO.The pixel defining layer PDL may include an opening exposing the anodeelectrode ANO. The pixel defining layer PDL may be formed of an organicinsulating material or an inorganic insulating material.

The organic light emitting layer EL may be disposed on the top surfaceof the anode electrode ANO and in the opening of the pixel defininglayer PDL. A cathode electrode CAT may be disposed on the organic lightemitting layer EL and the pixel defining layer PDL. The cathodeelectrode CAT may be a common electrode disposed over the pixels P.

A capping layer 170 may be disposed on the cathode electrode CAT. Thecapping layer 170 may cover the cathode electrode CAT. The capping layer170 may be a multilayer in which an inorganic layer and an organic layerare alternately laminated, but the disclosure is not limited thereto.

The end portion of the cathode electrode CAT may be terminated at adistance from the side surface of the display panel 10. The end portionof the cathode electrode CAT may be covered by the capping layer 170.Therefore, the cathode electrode CAT and the display pad DP may beinsulated (electrically disconnected).

The second substrate 200 may be disposed on the capping layer 170. Thesecond substrate 200 may be a transparent substrate. The secondsubstrate 200 may include a glass substrate. The second substrate 200may be spaced apart from the capping layer 170 by a gap GP (refer toFIG. 4).

The sealant SLT may bond the first substrate 100 to the second substrate200. The sealant SLT may be disposed along the edges of the secondsubstrate 200. The other side surface of the sealant SLT in the seconddirection DR2 may be aligned with the base substrate 101 and the secondsubstrate 200. The other end portion of the sealant SLT in the seconddirection DR2 may extend to a side surface of the display connection padDCP in the second direction DR2.

The sealant SLT may form the gap GP between the first substrate 100 andthe second substrate 200. The gap GP may be filled with air or an inertgas. The second substrate 200 and sealant SLT may prevent permeation ofmoisture into the first substrate 100. The sealant SLT may include amineral adhesive member such as a fit. However, the disclosure is notlimited thereto, and the sealant SLT may include an organic adhesivemember.

FIG. 7 is a schematic plan view of a touch member according to anembodiment. FIG. 8 is a schematic cross-sectional view of a touch memberaccording to an embodiment. FIG. 9 is a schematic cross-sectional viewtaken along lines IXa-IXa′, IXb-IXb′, and IXc-IXc′ of FIG. 7.

Referring to FIGS. 7 to 9, a sensing area SA and a non-sensing area NSAmay be defined in the touch member 300. The sensing area SA is an areaof the touch member 300 where a touch input is detected. Although thenon-sensing area NSA is not an area where a touch input is directlydetected, the non-sensing area NSA may prevent coupling of touch signallines TL1 and TL2 electrically connected to electrode portions fordetecting a touch input and prevent the touch signal lines TL1 and TL2from becoming disconnected due to static electricity. For example,although not shown, a touch ground line (not shown) adjacent to thetouch signal lines TL1 and TL2, a touch antistatic line (not shown)adjacent to each of the touch signal lines TL1 and TL2, and the like maybe disposed in the non-sensing area NSA, such that the non-sensing areaNSA may assist the detection of the touch input in the sensing area SA.

The sensing area SA may overlap the display area DA of the display panel10 shown in FIG. 5. The non-sensing area NSA may overlap the non-displayarea NDA of the display panel 10 shown in FIG. 5. In some embodiments,the sensing area SA may be substantially the same as the display area DAof the display panel 10, and the non-sensing area NSA may besubstantially the same as the non-display area NDA of the display panel10.

The non-sensing area NSA may include the touch pad area TPA where touchpads TP are disposed. The touch pad area TPA may be disposed at thelower end (the other end in the second direction DR2 in the drawing) ofthe touch member 300 in a plan view. In the touch pad area TPA, thetouch pads TP may be disposed in parallel in the first direction DR1.The outer surface (the other side surface in the second direction DR2 inthe drawing) and a part of the top surface (a side surface in the thirddirection DR3 in the drawing) of the touch pad TP may be exposed to theoutside. The touch pads TP may be disposed on a surface that isperpendicular to the side surface of the display panel 10 where thefirst circuit board 400 and second circuit board 500 are side-bonded.

The outer surface and the part of the top surface of the touch pad TPexposed to the outside may be partially covered by the touch connectionpad TCP. The arrangement of the touch pad TP and the touch connectionpad TCP will be described in detail later.

The touch member 300 may include electrode portions 310 and 330 disposedin the sensing area SA to detect a user's touch, and the touchconnection pads TCP disposed in a touch pad area TPA around the sensingarea SA. The touch connection pads TCP may be formed on the touch member300 at an edge of the touch member 300 and electrically connected to thesecond circuit board 500.

Referring to FIGS. 8 and 9, The touch member 300 may include a firstconductive layer ML1 disposed on the second substrate 200, a firstinsulating layer ILD1 disposed on the first conductive layer ML1, asecond conductive layer ML2 disposed on the first insulating layer ILD1,and a second insulating layer ILD2 disposed on the second conductivelayer ML2.

The first conductive layer ML1 may include a connection electrode CEdisposed in the sensing area SA, the touch pad TP disposed in thenon-sensing area NSA and electrically connected to the touch connectionpad TCP, and a wiring TL that electrically connects the connectionelectrode CE to the touch pad TP. The first conductive layer ML1 maycontain a conductive material having a resistance smaller than that ofthe second conductive layer ML2 to be described later. The touch pads TPand other components of the first conductive layer ML1 may be disposedon a display surface of the second substrate 200. The display surface ofthe second substrate 200 may be a plane parallel to the display area DAwhere the image is displayed. The display surface is perpendicular toside surface of the of the display panel 10 where the first circuitboard 400 and second circuit board 500 are side-bonded.

The connection electrode CE may electrically connect the adjacent secondelectrode portions 330 to be described later through a first contacthole CNT1.

The touch pad TP may extend from the wiring TL. The top surface and theouter surface of the touch pad TP may be exposed to the outside. Thetouch connection pads TCP (see FIG. 10) may be attached to the topsurface and the outer surface of the touch pad TP exposed to theoutside. The arrangement of the touch pad TP and the touch connectionpad TCP will be described in detail later. The touch pad TP may containan opaque metal. For example, the touch pad TP may be formed as a singlelayer or multiple layers made of any one of molybdenum (Mo), aluminum(Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium(Nd) and copper (Cu) or an alloy thereof.

The first insulating layer ILD1 may be disposed on the first conductivelayer ML1. The first insulating layer ILD1 may be disposed across thesensing area SA and the non-sensing area NSA. In some embodiments, thefirst insulating layer ILD1 may contain an insulating material. In someembodiments, the insulating material may be an inorganic insulatingmaterial or an organic insulating material.

The first insulating layer ILD1 may include the first contact hole CNT1and a second contact hole CNT2. The adjacent second electrode portions330 may be electrically connected through the first contact hole CNT1.The wiring TL may be electrically connected to the first electrodeportion 310 and the second electrode portion 330 to be described laterthrough the second contact hole CNT2.

The second conductive layer ML2 may include a first electrode portion310 and a second electrode portion 330. The first electrode portion 310and the second electrode portion 330 may be disposed in the sensing areaSA. One of the first electrode portion 310 and the second electrodeportion 330 may be a driving electrode, and the other electrode portionmay be a sensing electrode. In the embodiment, a case where the firstelectrode portion 310 may be the driving electrode and the secondelectrode portion 330 may be the sensing electrode will be described asan example. In case that the first electrode portion 310 is the drivingelectrode and the second electrode portion 330 is the sensing electrode,the wiring TL electrically connected to the first electrode portion 310may be a touch driving line, and the wiring TL electrically connected tothe second electrode portion 330 may be a touch sensing line. Asdescribed above, the adjacent second electrode portions 330 may beelectrically connected to the connection electrode CE through the firstcontact hole CNT1.

The second conductive layer ML2 may include a conductive material havinglight transmittance. The sensing area SA overlaps the display area DA ofthe display panel 10 as described above. The first electrode portion 310and the second electrode portion 330 disposed in the sensing area SA maycontain a conductive material having light transmittance and transmitlight emitted from the display panel 10. For example, the secondconductive layer ML2 may contain indium tin oxide (ITO) having anamorphous structure. The resistance of indium tin oxide having anamorphous structure with an irregular interatomic structure may begreater than the resistance of the material of the above-described firstconductive layer ML1.

If the resistance of the conductive layer constituting the touch member300 is high, the self-power consumption for driving the touch member 300may be increased. Furthermore, when the above-described materials of thesecond conductive layer ML2 are used for the electrode portion forsensing a touch input, resistive-capacitive (RC) delay may occur due toa high resistance. Therefore, to allow the conductive layer constitutingthe electrode portion of the touch member 300 to have a low resistancewhile ensuring light transmittance, the first conductive layer ML1having a relatively low resistance may be electrically connected to thesecond conductive layer ML2.

A second insulating layer ILD2 may be disposed on the second conductivelayer ML2. The second insulating layer ILD2 may be disposed across thesensing area SA and the non-sensing area NSA. In some embodiments, thesecond insulating layer ILD2 may include an insulating material. In someembodiments, the insulating material may be an inorganic insulatingmaterial or an organic insulating material.

FIG. 10 is a schematic diagram illustrating a side surface of a displaydevice according to an embodiment. FIG. 11 is a schematiccross-sectional view taken along line XI-XI′ of FIG. 10. FIG. 12 is aschematic cross-sectional view taken along line XII-XII′ of FIG. 10.FIG. 13 is a schematic cross-sectional view taken along line XIII-XIII′of FIG. 10. FIG. 14 is a schematic cross-sectional view taken along lineXIV-XIV′ of FIG. 10. The side surface of the display device 1 shown inFIG. 10 is a side surface where the display connection pads DCP and thetouch connection pads TCP are disposed.

The arrangement relationship between the display pad DP, the displayconnection pad DCP, the touch pad TP, and the touch connection pad TCPwill be described in detail with reference to FIGS. 10 to 14.

Referring to FIGS. 10 to 15, a side surface of the display device 1 mayinclude the display pad area DPA where the display connection pads DCPare disposed, and the touch pad area TPA where the touch connection padsTCP are disposed.

The display connection pads DCP may be disposed along the firstdirection DR1 on the other side surface of the display panel 10 in thesecond direction DR2. Each of the display connection pads DCP may have ashape extending in the third direction DR3. Each of the displayconnection pads DCP may have a first width W1 in the first direction DR1and a first length 11 in the third direction DR3. The first length 11may be smaller than the thickness of the display panel 10 in the thirddirection DR3.

Each of the display connection pads DCP may electrically contact thedisplay pad DP. Each of the display connection pads DCP may include afirst protrusion DCPP protruding toward the sealant SLT between thefirst substrate 100 and the second substrate 200. The first protrusionDCPP may be disposed between the display pad DP and the second substrate200. The second substrate 200 may include an upper chamfer portion 200 adisposed at an end overlapping the display pad DP as shown in FIG. 11.

Referring to FIG. 11, a top surface DPU of the display pad DP maypartially contact the display connection pad DCP. The top surface DPU ofthe display pad DP may contact the first protrusion DCPP of the displayconnection pad DCP. An outer surface DPB of the display pad DP maycontact the display connection pad DCP.

Referring to FIG. 12, the display connection pad DCP may have a displaynon-etched surface DCPa and a display etched surface DCPb. The displaynon-etched surface DCPa may be a surface that is not laser etchedbecause a laser beam is not irradiated thereto in a manufacturingprocess of the display connection pad DCP, and the display etchedsurface DCPb may be a surface that is laser etched because the laserbeam is irradiated thereto in the manufacturing process of the displayconnection pad DCP. The other side surface of the display connection padDCP in the second direction DR2 may be the display non-etched surfaceDCPa, and a side surface and the other side surface of the displayconnection pad DCP in the first direction DR1 may be the display etchedsurface DCPb.

Referring to FIG. 10, the touch connection pads TCP may be disposedalong the first direction DR1 at the other end portion of the displaydevice 1 in the second direction DR2. Each of the touch connection padsTCP may have a shape extending in the second direction DR2 or in thethird direction DR3. Each of the touch connection pads TCP may have ashape extending in the third direction DR3 on the other side surface ofthe display panel 10 in the second direction DR2, and may have a shapeextending in the second direction DR2 on one side surface of the touchmember 300 in the third direction DR3. Each of the touch connection padsTCP may have a second width W2 greater than the first width W1 in thefirst direction DR1 and a second length 12 greater than the first length11 in the longitudinal direction. Each of the touch connection pads TCPmay partially cover the touch pad TP disposed on the touch member 300.

Referring to FIG. 13, each of the touch connection pads TCP mayelectrically contact the touch pad TP. Each of the touch connection padsTCP may include a second protrusion TCPP protruding toward the sealantSLT between the first substrate 100 and the second substrate 200. Thesecond protrusion TCPP may be disposed between the first substrate 100and the second substrate 200.

The other side surface TPB of the touch pad TP in the second directionDR2 may be in electrical contact with the touch connection pad TCP, anda side surface TPU of the touch pad TP in the third direction DR3 maypartially contact the touch connection pad TCP. The touch connection padTCP may cover the other side surface TPB of the touch pad TP in thesecond direction DR2 and a part of one side surface TPU of the touch padTP in the third direction DR3.

Referring to FIG. 14, the touch connection pad TCP may include a touchnon-etched surface TCPa and a touch etched surface TCPb. The touchnon-etched surface TCPa may be a surface that is not laser etchedbecause a laser beam is not irradiated thereto in a manufacturingprocess of the touch connection pad TCP, and the touch etched surfaceTCPb may be a surface that is laser etched because the laser beam isirradiated thereto in the manufacturing process of the touch connectionpad TCP. The other side surface of the touch connection pad TCP in thesecond direction DR2 may be the touch non-etched surface TCPa, and aside surface and the other side surface of the touch connection pad TCPin the first direction DR1 may be the touch etched surfaces TCPb.

The other side surface of the first substrate 100 in the seconddirection DR2 may include a first side surface 100 a disposed in a firstarea SA1 overlapping the display connection pad DCP, a second sidesurface 100 b disposed in a second area SA2 overlapping the touchconnection pad TCP, and a third side surface 100 c disposed in a thirdarea SA3 that does not overlap the display connection pad DCP and doesnot overlap the touch connection pad TCP. The connection pads DCP andTCP may not be disposed on the third side surface 100 c.

On the other side surface of the display panel 10 in the seconddirection DR2, the first area SA1, the second area SA2, and the thirdarea SA3 may be disposed on a same plane. The other side surface of thedisplay panel 10 in the second direction DR2 may have a flat shapewithout steps.

Furthermore, the other side surface of the display panel 10 in thesecond direction DR2 may have a uniform roughness for each region. Thefirst area SA1, the second area SA2 and the third area SA3 may have thesame roughness.

Referring to FIGS. 10 to 14, The display device 1 according to anembodiment may reduce damage to a substrate. Since a conductive materialCDL (refer to FIG. 17) is not disposed between the display pads DPdisposed along one direction, short circuits between the display pads DPmay be prevented. Furthermore, since the conductive material CDL is notdisposed between the touch pads TP disposed along one direction, shortcircuits between the touch pads TP may be prevented.

FIG. 15 is a schematic view illustrating an apparatus for manufacturinga display device according to an embodiment.

Referring to FIG. 15, an apparatus for manufacturing the display device1 according to an embodiment is an apparatus for patterning a conductivematerial CDL on a conductive film CDF and transferring the patternedconductive material CDL onto a surface of the display device 1.

The apparatus for manufacturing the display device 1 according to anembodiment may include a first stage ST1, a first laser module PLM foremitting a first laser beam PL toward the first stage ST1, a secondstage ST2 disposed at one side of the first stage ST1, a pressing tool700 disposed above the second stage ST2, and a second laser module CLMfor emitting a second laser beam CL toward the second stage ST2 with thepressing tool 700 interposed therebetween.

The conductive film CDF may be formed on the first stage ST1. The firststage ST1 may provide a space where the process of patterning theconductive material CDL is executed. The first stage ST1 may beconfigured such that an inclination angle is adjustable.

The conductive film CDF may include a reel conductive film CDF_R woundin a reel shape on a side of the first stage ST1. The reel conductivefilm CDF_R may be unreeled and fed toward the first stage ST1.

The conductive film CDF may include a first film part CDF1 in a statebefore reaching the first stage ST1 by being released from the reelconductive film CDF_R. The first film part CDF1 may include a base filmBF (refer to FIG. 17) and the conductive material CDL (refer to FIG. 17)disposed on the base film BF. The conductive material CDL may contain,for example, an epoxy binder material and silver (Ag) particles.However, the conductive material CDL is not limited thereto, and maycontain an electrically conductive material.

The first laser module PLM may be disposed above the first stage ST1 asshown in FIG. 17. The first laser module PLM may emit the first laserbeam PL toward the first stage ST1. The first laser beam PL may be ashort pulse laser beam. The first laser module PLM may pattern theconductive material CDL into a desired shape using the first laser beamPL.

The second stage ST2 may be disposed at a side of the first stage ST1.The second stage ST2 may provide a space where the process oftransferring the display connection pad DCP and the touch connection padTCP onto a side surface of the display device 1 is performed.Furthermore, the second stage ST2 may provide a space where the processof bonding the first circuit board 400 and the second circuit board 500onto the display connection pad DCP and the touch connection pad TCP ofthe display device 1, respectively, is performed. The second stage ST2may be configured such that the inclination angle is adjustable.

The process of transferring the display connection pad DCP and the touchconnection pad TCP onto one side surface of the display device 1, andthe process of bonding the first circuit board 400 and the secondcircuit board 500 onto the display connection pad DCP and the touchconnection pad TCP of the display device 1, respectively, will bedescribed later with reference to FIGS. 16 to 20.

The second laser module CLM may be disposed above the second stage ST2.The second laser module CLM may emit the second laser beam CL toward thesecond stage ST2. The second laser beam CL may be a continuous wave (CW)laser beam. The second laser module CLM may transfer the displayconnection pad DCP and the touch connection pad TCP onto a side surfaceof the display device 1 using the second laser beam CL. The second lasermodule CLM may bond the first circuit board 400 and the second circuitboard 500 onto the display connection pad DCP and the touch connectionpad TCP, respectively, using the second laser beam CL.

The pressing tool 700 may be disposed between the second stage ST2 andthe second laser module CLM. The pressing tool 700 may assist thetransfer process and the bonding process by pressing or heating a sidesurface of the display device 1. Furthermore, the pressing tool 700 maytransmit the second laser beam CL used for transferring the displayconnection pad DCP and the touch connection pad TCP and bonding thefirst circuit board 400 and the second circuit board 500 onto thedisplay connection pad DCP and the touch connection pad TCP,respectively.

The pressing tool 700 may include a first pressing tool 710 and a secondpressing tool 720 disposed below the first pressing tool 710.

The first pressing tool 710 may contain a transparent material such asquartz, glass, or the like, and may transmit the second laser beam CL.The bottom surface of the first pressing tool 710 may have an inclinedsurface. Since the bottom surface of the pressing tool 700 has aninclined surface, the pressing tool 700 may easily press an objecthaving a bent surface.

The second pressing tool 720 may be disposed to cover the first pressingtool 710. The second pressing tool 720, which is a component of thepressing tool 700 that is in contact with the display device 1 in thetransfer process and the bonding process, may contain an elasticmaterial. For example, the second pressing tool 720 may contain silicon.The damage to the display device 1 in the transfer process and thebonding process may be minimized by the second pressing tool 720.

The conductive film CDF includes a second film part CDF2 including apatterned conductive material in a state before reaching the secondstage ST2 after passing through the first stage ST1, and a third filmpart CDF3 including a patterned conductive material in a state afterpassing through the second stage ST2. The second film part CDF2 mayinclude a base film BF and a patterned conductive material (refer to“DPP” and “TPP” in FIG. 17) disposed on the base film BF. The third filmpart CDF3 may be substantially the same as the base film BF since thepatterned conductive materials DPP and TPP have been transferred to thedisplay device 1.

FIG. 16 is a flowchart showing a method for manufacturing a displaydevice according to an embodiment. FIGS. 17 to 20 are schematic diagramsillustrating a method for manufacturing a display device according to anembodiment.

Referring to FIG. 16, a method for manufacturing the display device 1according to an embodiment may include a step S11 of patterning theconductive material CDL on the conductive film CDF, a step S21 oftransferring the patterned conductive material onto the display device 1to form a pad, and a step S31 of attaching the printed circuit board onthe pad of the display device 1.

Referring to FIG. 17, the step of patterning the conductive material CDLon the conductive film CDF may be performed using the first laser modulePLM described with reference to FIG. 15. The first laser module PLM mayemit the first laser beam PL that is a short pulse laser beam. In anembodiment, the first laser module PLM may emit the first laser beam PLin a state where the first laser module PLM is fixed and the conductivefilm CDF moves. In another example, the first laser module PLM may emitthe first laser beam PL while moving together with the conductive filmCDF, but the disclosure is not limited thereto. The patterning of theconductive material CDL on the conductive film CDF may be performed atthe same time as the feeding of the conductive film CDF.

When the conductive material CDL on the conductive film CDF ispatterned, pad pattern areas PPA may be formed on the base film BF. Thepad pattern areas PPA may be disposed along the longitudinal directionof the conductive film CDF. Each of the pad pattern areas PPA mayinclude display pad patterns DPP and touch pad patterns TPP.

The display pad patterns DPP may be disposed in the longitudinaldirection of the conductive film CDF. Each of the display pad patternsDPP may become the display connection pad DCP in the display device 1 bythe transfer process to be described later. Each of the display padpatterns DPP may have a shape extending in the width direction of theconductive film CDF. Each of the display pad patterns DPP may have afirst width W1 in the longitudinal direction of the conductive film CDFand a first length 11 in the width direction of the conductive film CDF.

The touch pad patterns TPP may be disposed in the longitudinal directionof the conductive film CDF. The touch pad patterns TPP may be disposedat one side of the display pad patterns DPP in the longitudinaldirection of the conductive film CDF. Each of the touch pad patterns TPPmay become the touch connection pad TCP of the display device 1 by thetransfer process to be described later. Each of the touch pad patternsTPP may have a shape extending in the width direction of the conductivefilm CDF. Each of the touch pad patterns TPP may have a second width W2greater than the first width W1 in the longitudinal direction of theconductive film CDF, and may have a second length 12 greater than thefirst length 11 in the width direction of the conductive film CDF.

Referring to FIGS. 18 and 19, after the step S11 of patterning theconductive material CDL on the conductive film CDF, the step S21 oftransferring the patterned conductive material CDL onto the displaydevice 1 to form a pad may be executed. The patterned conductivematerial CDL may form the display pad pattern DPP and the touch padpattern TPP.

The second laser beam CL may be irradiated in a state where thepatterned conductive film CDF is disposed on a side surface of thedisplay device 1 and the conductive film CDF is pressed by the pressingtool 700. The second laser beam CL may be emitted from the second lasermodule CLM and may be a continuous wave (CW) laser beam. At this time,the surface of the conductive film CDF on which the display pad patternDPP and the touch pad pattern TPP are formed may be disposed toward thedisplay device 1. The display pad pattern DPP and the touch pad patternTPP may be transferred onto a side surface of the display device 1. Dueto this process, the display pad pattern DPP on the conductive film CDFmay become the display connection pad DCP, and the touch pad pattern TPPon the conductive film CDF may become the touch connection pad TCP.

In case that the display pad pattern DPP of the conductive film CDF istransferred to the display device 1, the display pad pattern DPP maybecome the display connection pad DCP. In case that the touch padpattern TPP of the conductive film CDF is transferred to the displaydevice 1, the touch pad pattern TPP may become the touch connection padTCP.

The pressing tool 700 may cover the entire area where the displayconnection pad DCP and the touch connection pad TCP are formed. Forexample, the pressing tool 700 may cover a part of the top surface ofthe touch member 300. Furthermore, the second laser beam CL may beemitted and irradiated to the entire area where the display pad patternDPP and the touch pad pattern TPP are transferred.

As described above, the pressing tool 700 may assist the transferprocess by pressing or heating a side of the display device 1 on whichthe display connection pad DCP and the touch connection pad TCP areformed. The pressing tool 700 may transmit the second laser beam CL usedwhen transferring the display connection pad DCP and the touchconnection pad TCP.

Referring to FIG. 20, after the step S21 of transferring the patternedconductive material CDL to the display device 1 to form a pad, the stepS31 of attaching the printed circuit board onto the pad of the displaydevice 1 may be executed. When the display connection pad DCP and thetouch connection pad TCP are formed on the display device 1, the firstcircuit board 400 having the display driving circuit 410 may be disposedon the display connection pad DCP and the second circuit board 500having the touch driving circuit 510 may be disposed on the touchconnection pad TCP.

Pressing the first circuit board 400 and the second circuit board 500onto a side surface of the display device 1 and laser bonding the firstcircuit board 400 and the second circuit board 500 may be performedsubstantially simultaneously.

The step of laser bonding the first circuit board 400 and the secondcircuit board 500 may be performed by transmitting the laser beamthrough the pressing tool 700. In case that the first circuit board 400and the second circuit board 500 are disposed on one side surface of thedisplay device 1, the second laser beam CL may be irradiated in a statewhere the first circuit board 400 and the second circuit board 500 arepressed by the pressing tool 700. As described in the transfer process,the second laser beam CL may be emitted from the second laser module CLMand may be a continuous wave (CW) laser beam.

An anisotropic conductive film CDF may be disposed between the displayconnection pad DCP and the first circuit board 400 and between the touchconnection pad TCP and the second circuit board 500. The displayconnection pad DCP and the first circuit board 400 may be electricallyconnected through the anisotropic conductive film CDF, and the touchconnection pad TCP and the second circuit board 500 may be electricallyconnected through the anisotropic conductive film CDF.

Due to the step of laser bonding the first circuit board 400 and thesecond circuit board 500, the anisotropic conductive film CDF disposedbetween the first and second circuit boards 400 and 500 and theconnection pads is cured, so that the first circuit board 400 and thesecond circuit board 500 may be attached onto the display connection padDCP and the touch connection pad TCP, respectively.

In accordance with the method for manufacturing the display device 1according to an embodiment, the display pad pattern DPP and the touchpad pattern TPP may be formed by patterning the conductive material CDLon a separate conductive film CDF, and then transferred onto one sidesurface of the display device 1 to form the display connection pad DCPand the touch connection pad TCP. Accordingly, the display device 1having a side surface to which the first circuit board 400 and thesecond circuit board 500 are attached may be manufactured by a simpleprocess. In accordance with the method for manufacturing the displaydevice 1 according to an embodiment, damage to the display device 1 maybe minimized.

Hereinafter, an embodiment of the display device 1 having a side surfaceto which the first circuit board 400 and the second circuit board 500are attached will be described. In the following embodiments, adescription of the same components as those of the above-describedembodiment will be omitted or simplified, and differences will bedescribed.

FIG. 21 is a cross-sectional view illustrating a display deviceaccording to an embodiment.

Referring to FIG. 21, a display device 1_1 according to the embodimentmay include a second substrate 200_1 having a shape different from thatof the second substrate 200 of the display device 1 according to anembodiment, and a display connection pad DCP_1.

The second substrate 200_1 may further include a lower chamfer portion200 b_1 expect for an upper chamfer portion 200 a_1 which corresponds tothe upper chamfer portion 200 a in FIG. 11. The display connection padDCP_1 may secure a wider contact area with the display pad DP due to thelower chamfer portion 200 b_1. Each of the display connection pads DCP_1may include a first protrusion DCPP_1 protruding toward the sealant SLTbetween the first substrate 100 and the second substrate 200_1. Thefirst protrusion DCPP_1 may be disposed between the display pad DP andthe second substrate 200_1. The other side surface of the display pad DPin the second direction DR2 may be in contact with the displayconnection pad DCP_1, and one side surface of the display pad DP in thethird direction DR3 may partially contact with the display connectionpad DCP_1. The display connection pad DCP_1 may cover the other sidesurface of the display pad DP in the second direction DR2 and a part ofa side surface of the display pad DP in the third direction DR3. Due tothe lower chamfer portion 200 b_1, the first protrusion DCPP_1 of theembodiment may protrude more toward the sealant SLT than the firstprotrusion DCPP of FIG. 11. Accordingly, it is possible to secure awider contact area between the display connection pad DCP_1 and thedisplay pad DP.

The display device 1_1 according to the embodiment may reduce damage toa substrate. Since a conductive material CDL is not disposed between thedisplay pads DP, short circuits between the display pads DP may beprevented. Furthermore, since the conductive material CDL is notdisposed between the touch pads TP, short circuits between the touchpads TP may be prevented.

In the display device 1_1 according to the embodiment, it is possible toimprove electrical conductivity between the display connection pad DCP_1and the display pad DP by securing a wider contact area between thedisplay connection pad DCP_1 and the display pad DP. Although not shown,it is also possible to improve electrical conductivity between the touchconnection pad TCP and the touch pad TP by securing a wider contact areabetween the touch connection pad TCP and the touch pad TP.

In concluding the detailed description, those skilled in the art willappreciate that many variations and modifications can be made to theembodiments without substantially departing from the principles of thedisclosure. Therefore, the disclosed embodiments are used in a genericand descriptive sense only and not for purposes of limitation. In someinstances, as would be apparent by one of ordinary skill in the art,features, characteristics, and/or elements described in connection withan embodiment may be used singly or in combination with features,characteristics, and/or elements described in connection with otherembodiments unless otherwise specifically indicated. Accordingly, itwill be understood by those of ordinary skill in the art that variouschanges in form and details may be made without departing from thespirit and scope of the disclosure as set forth in the following claims.

What is claimed is:
 1. A display device comprising: a display panelincluding display pads; display connection pads disposed on a sidesurface of the display panel and connected to the display pads; a touchmember including touch pads disposed on a display surface perpendicularto the side surface of the display panel; and touch connection padsoverlapping a top surface of the touch member and the side surface ofthe display panel, the touch connection pads connected to the touchpads, wherein the side surface of the display panel includes: a firstarea overlapping the display connection pads; a second area overlappingthe touch connection pads; and a third area which does not overlap thedisplay connection pads and does not overlap the touch connection pads,and the first area, the second area, and the third area are located on asame plane.
 2. The display device of claim 1, wherein the side surfaceof the display panel has a uniform roughness in the first area, thesecond area, and the third area.
 3. The display device of claim 1,wherein the side surface includes: a display pad area where the displaypads and the display connection pads are arranged; and a touch pad areawhere the touch pads and the touch connection pads are arranged, and thetouch pad area and the display pad area are arranged in a firstdirection.
 4. The display device of claim 3, wherein the display padsand the touch pads are arranged in the first direction.
 5. The displaydevice of claim 3, further comprising: a first circuit board disposed onthe display connection pads, and a display driving circuit beingdisposed on the first circuit board; and a second circuit board disposedon the touch connection pads, and a touch driving circuit being disposedon the second circuit board.
 6. The display device of claim 5, whereinthe second circuit board partially overlaps the top surface of the touchmember.
 7. The display device of claim 1, wherein the display panelincludes: a first substrate; a second substrate disposed on the firstsubstrate; and a sealant disposed between the first substrate and thesecond substrate.
 8. The display device of claim 7, wherein each of thedisplay connection pads and the touch connection pads has a shapeprotruding toward the sealant.
 9. The display device of claim 7, whereinthe second substrate includes a chamfer portion disposed at an endoverlapping the display pad.
 10. An apparatus for manufacturing adisplay device, the apparatus comprising: a first stage; a first lasermodule that emits a first laser beam toward the first stage; a secondstage disposed on a side of the first stage; a pressing tool disposedabove the second stage; and a second laser module that emits a secondlaser beam toward the second stage, the pressing tool being disposedbetween the second laser module and the second stage, wherein the firstlaser beam is a short pulse laser beam, and the second laser beam is acontinuous wave laser beam.
 11. The apparatus of claim 10, wherein thepressing tool includes a silicon member disposed at a lower portion ofthe pressing tool.
 12. The apparatus of claim 11, wherein the pressingtool includes a transparent material.
 13. The apparatus of claim 11,wherein a bottom surface of the pressing tool includes a chamferportion.
 14. The apparatus of claim 10, wherein each of the first stageand the second stage has an adjustable inclination angle.
 15. Theapparatus of claim 10, further comprising a conductive film including aconductive material that is patterned on the first stage and transferredonto the side surface of the display device on the second stage.
 16. Amethod for manufacturing a display device, the method comprising:patterning a conductive material on a conductive film to form firstpatterns and second patterns that are larger than the first patterns;transferring the first patterns onto a side surface of the displaydevice to form a first pad; transferring the second patterns onto theside surface of the display device to form a second pad; attaching afirst circuit board on the first pad; and attaching a second circuitboard on the second pad.
 17. The method of claim 16, wherein thepatterning of the conductive material includes applying a short pulselaser beam.
 18. The method of claim 16, wherein the forming of the firstpad and the forming of the second pad include applying a continuous wavelaser beam.
 19. The method of claim 18, wherein the forming of the firstpad and the forming of the second pad comprise: disposing the conductivefilm including the first patterns and the second patterns on the sidesurface of the display device; and disposing a pressing tool on theconductive film to irradiate the continuous wave laser beam.
 20. Themethod of claim 19, wherein the attaching of the first circuit board andthe attaching of the second circuit board comprise: disposing the firstcircuit board on the first pad; disposing the second circuit board onthe second pad; and disposing the pressing tool on the first circuitboard and the second circuit board to irradiate the continuous wavelaser beam.